Fix iPhone X Unable to Activate By Jumper Wires

Step 1

Repair step

⌕

• The iPhone X has been dropped and can’t work normally. After restoring, the phone can’t be activated. Next, we try to activate the phone with 3uTools.
• Connect the phone to the computer and open 3uTools. Click Activate Now and Start.
• The activation normally takes several minutes. After about 20 minutes, the phone is stuck in the activation interface. The phone is still unable to be activated.

Step 2

Repair step

⌕

• Next, we need to separate the motherboard for further check.
• Put the motherboard on the 165 °C Heating Platform to heat. When the temperature reaches 165 °C, remove the logic board and signal board with tweezers.

Step 3

Repair step

⌕

• Clear thermal grease with a Sculpture Knife.
• After separation, it is found that there are many missing pads. Then we restore useful pads from missing pads with jumper wires.
• Attach the logic board to the holder and remove tin on the bonding pad with Soldering Iron at 365 °C and Solder Wick.

Step 4

Repair step

⌕

• Apply some Solder Paste to the missing pads and apply tin with Hot Air Gun at 340 °C. Clean the bonding pad with PCB Cleaner and apply some Paste Flux.
• Solder 0.02 mm copper wires to the bonding pad with Soldering Iron. Please be noted that copper wires must be soldered firmly.
• Clean with PCB Cleaner again and curl the copper wires to make pads with Tweezers and Sculpture Knife.

Step 5

Repair step

⌕

• Apply Solder Mask to the bonding pad to fix the copper wires and solidify the solder mask with UV Lamp for 5 minutes.
• Scrape away excess solder mask with Sculpture Knife to show the copper wires.
• Next, remove tin on the bonding pad with Soldering Iron at 365 °C and Solder Wick. Clean the bonding pad with PCB Cleaner.

Step 6

Repair step

⌕

• Attach the signal board to the Reballing Platform and put the reballing stencil in position.
• To prevent solder paste from flowing into the motherboard, insert a metal plate.
• Apply evenly a layer of low-temperature Solder Paste.

Step 7

Repair step

⌕

• Put the motherboard on the 165 °C Heating Platform to heat.
• After the solder balls are formed, turn the power off and cool the signal board. Apply some Paste Flux and align the logic board with the signal board.
• Keep heating for 1 minute when the temperature reaches 165 °C. Turn the power off and cool the motherboard.

Step 8

Repair step

⌕

• Then we install the motherboard to the phone. Open 3uTools to activate the phone. The phone is successfully activated.
• Test other functions and other functions work well.