Home/ Repair guides/ Fix iPhone 12 Pro Stuck on Apple Logo

Official iFixit API visual reference

Fix iPhone 12 Pro Stuck on Apple Logo

Attributed iFixit repair guide for iPhone 12 Pro.

Apple iPhone 12 Pro Moderate 45 minutes Guide 143071

Licensed iFixit integration

This attributed iFixit guide is displayed through Fixonic's recorded commercial API permission. iFixit remains the independent source and author of the procedure.

Step 1

How to Fix iPhone 12 Pro Stuck on Apple Logo

⌕

TOOL USED ON THIS STEP Tweezers Referenced by the iFixit guide

View item

This phone could be turned on before, but it got stuck on the Apple logo during startup after charging.
Disconnect other flex cables except for the power cable. Connect the display and power cable. The phone still gets stuck on the Apple logo. So we can rule out the possibility of other cable faults. It can be confirmed that the phone gets stuck on the Apple logo because of a motherboard fault. The boot current stops at about 240 mA.

Step 2

Repair step

⌕

TOOL USED ON THIS STEP Tweezers Referenced by the iFixit guide

View item

Since the current stops at about 240 mA and the phone is frozen on the Apple logo after charging, we can narrow down the fault range to the USB charging circuit. Because the USB IC is at the very front end of the USB charging circuit. Next, we try to replace the USB IC.
Put the motherboard on the 200 °C Heating Platform to heat. Heat the motherboard with a 330 °C vertical Hot Air Gun. Pry the logic board with a Pry Bar while heating. When the logic board becomes loose, remove it with tweezers.

Step 3

Repair step

⌕

TOOL USED ON THIS STEP Soldering Iron Referenced by the iFixit guide

View item

TOOL USED ON THIS STEP Tweezers Referenced by the iFixit guide

View item

Attach the logic board to the holder. Apply some Paste Flux on the USB IC. Heat the USB IC with the Hot Air Gun at 340 °C and airflow 3. Nudge the USB IC with tweezers while heating. Take out the USB IC if it becomes loose.
Remove tin on the bonding pad with Soldering Iron at 365 °C and Hot Air Gun at 340 °C. Clean the tin on the bonding pad again with solder wick.

Step 4

Repair step

⌕

TOOL USED ON THIS STEP Soldering Iron Referenced by the iFixit guide

View item

TOOL USED ON THIS STEP Tweezers Referenced by the iFixit guide

View item

Apply some Paste Flux to the bonding pad. Align the new USB IC. Heat to solder the USB IC with the Hot Air Gun at 340 °C. Remove tin on the bonding pad with a soldering iron at 365 °C and solder wick. Clean the tin on the bonding pad of the signal board with the same method. Clean the bonding pad with PCB Cleaner.
Then we install the motherboard in the Testing Fixture. Connect the power cable and screen. Trigger the boot-up with tweezers. The phone can be turned on.

Step 5

Repair step

⌕

Then we need to reball the signal board. Attach the signal board to the Reballing Platform. Put the reballing stencil in position. Apply a layer of Solder Paste evenly.
Wipe clean excess solder paste and remove the reballing stencil.

Step 6

Repair step

⌕

TOOL USED ON THIS STEP Tweezers Referenced by the iFixit guide

View item

Put the signal board on the 160 °C Heating Platform to heat. After the solder balls are formed, cool the signal board. Apply some Paste Flux on the bonding pad. Align the logic board with the signal board.
Keep heating to recombine the motherboard. Remove the motherboard after heating for about 2 minutes. Connect the motherboard with a power cable after it has cooled. Trigger the boot-up with tweezers. The boot current jump is normal.
Then we install the motherboard. The phone can be turned on. The IMEI number can also be seen. The fault has been cleared.